BISPHENOL A (BPA)

Product Details:

Physical Form Powder
Molecular Weight 228.291 gmol1 Grams (g)
Application Industrial
Molecular Formula C15H16O2
Properties Bisphenol A is a colourless solid which is soluble in most common organic solvents, but has very poor solubility in water.
Melting Point 155 C
EINECS No 201-245-8
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BISPHENOL A (BPA) Price And Quantity

Minimum Order Quantity 200 Kilograms

BISPHENOL A (BPA) Product Specifications

Properties Bisphenol A is a colourless solid which is soluble in most common organic solvents, but has very poor solubility in water.
EINECS No 201-245-8
Melting Point 155 C
Storage Other
CAS No 80-05-7
Density 1.217 g/cm3 Gram per cubic centimeter(g/cm3)
Grade Industrial
Physical Form Powder
Molecular Weight 228.291 gmol1 Grams (g)
Application Industrial
Molecular Formula C15H16O2

BISPHENOL A (BPA) Trade Information

Supply Ability 2000 Kilograms Per Month
Delivery Time 7 Days
Packaging Details 25KG BAG

Product Description

Product Overview:

Bisphenol A (BPA) is a key raw material used in the production of polycarbonate plastics and epoxy resins, providing exceptional strength, clarity, and thermal resistance. It is widely utilized in coatings, adhesives, and composites, offering superior mechanical and chemical properties. Its excellent durability and stability make it an essential component in industrial applications requiring high performance.

Key Features & Benefits:

High Mechanical Strength Enhances durability in plastic and resin formulations.
Excellent Chemical & Heat Resistance Provides stability in harsh environments.
Superior Clarity & Transparency Ideal for optical-grade applications.
Versatile Compatibility Works with multiple polymer and resin systems.
Enhanced Adhesion & Coating Performance Improves protective and industrial coatings.

Applications:

Epoxy Resins & Coatings: Used in protective coatings for industrial and marine applications.
Polycarbonate Plastics: Provides strength and impact resistance for various plastic products.
Adhesives & Sealants: Enhances bonding and durability in structural applications.
Composites & Molding Compounds: Used in high-performance thermoset materials.
Electrical & Electronic Components: Ensures heat resistance and insulation properties.

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